Glass Etching Resist

Hydrofluoric Acid Resistant Photoresist for Wet Etching of Glass

Glibes N-100 is an alternative resist that is extremely resistant to hydrofluoric acid, allowing small, deep patterns to be formed in wet etching (engraving) of glass.

Wet Glass Etching Resist Glibes N-100

Glibes N-100 offers excellent resistance to hydrofluoric acid and can be used for wet etching of glass.

SEM 40μm Space

After Wet Etching/After Resist Removal
Measurement Dimensions

Resist Dimensions

Etching Width

Etching Depth
43.3 110.6 30.3

SEM 7.0μm Space

After Wet Etching/After Resist Removal
  • Resist dimensions (bottom) = 8.7μm
  • Glass etch width = 49.2μm
  • Glass etch depth = 19.0μm
Resist Bottom/Glass etch width/Glass etch depth

Wet Glass Etching Resist Glibes N-100

Glass cutting by wet etching is capable of cutting without generating micro-cracks on the cutting surface, which makes it possible to secure more than twice the strength of glass compared to the mechanical cutting method.

  • Average glass strength
  • Mechanical cutting: 600 MPa
  • Chemical cutting: >1000 MPa
Wet Glass Etching Resist Glibes N-100
Wet Glass Etching Resist Glibes N-100

Conditions

  • Glass size: 120×60×0.7t (mm)
  • Glass type: Dragontrail (AGC)
  • DOL:18um
  • n=20

Measurement

  • Equipment: FTN1-13A (AIKOH Engineering)
  • Weighting speed: 1mm/1min
Strength Measurement Method

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