Photoresists provided by Tokyo Ohka Kogyo are indispensable for semiconductor manufacturing. The company also provides high purity chemicals and equipment for the photolithography process, which uses light to achieve fine processing. The following will provide an overview of the semiconductor manufacturing process and the products used.
Photoresist attributes its name due to its photosensitive properties,
specifically that it is a material that changes in response to light. The first step in the semiconductor interconnect manufacturing process is to apply photoresist to the silicon wafer (thin, disc-shaped). We offer a wide range of photoresist materials as well as coating equipment to meet a variety of requirements and conditions.
The photomask (blueprint) is transferred to the photoresist just as a photograph is burned onto photographic paper.
The photoresist used in the photolithography process can be either negative, where the exposed areas do not dissolve in the developing solution and remain as a pattern, or positive, where the exposed areas dissolve in the developing solution and the unexposed areas remain as a pattern. There are also various wavelengths of light, and we handle photoresists that are compatible with all wavelengths, from g-line to EUV.
The blueprint pattern transferred to the photoresist through exposure is formed in a fashion similar to developing a photograph.
In order to form the pattern, the unnecessary parts of the resist are dissolved and removed by dipping in a special developer that is compatible with various types of photoresists. We offer a variety of developer solutions for different types of resists.
The photoresist pattern formed after developing is used as a protective film, and areas without photoresist are etched. There are two types of etching: dry etching and wet etching. We offer vacuum UV hardening systems that improve heat resistance, etching properties, and plating resistance.
Photoresist that is no longer needed is removed. Using the appropriate stripper for each type of photoresist, the photoresist can be removed swiftly. We provide high purity cleaning solutions, stripping solutions, and thinners.
After coating the wafer with a material to diffuse impurities, the wafer is baked at high temperatures to form the semiconductor region. We also provide diffusion materials.
Aluminum or copper is used to form the wiring. We provide materials to form interlayer insulating films.
These processes are repeated to form the integrated circuits and complete the semiconductor devices on the wafer.
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