Black Resist

Resist with Environmental Characteristics in Addition to Uniformity and Fineness of the Formed Film

As part of the development of photolithography for display applications, we have been designing and developing photosensitive black pigment films. In addition to achieving uniformity and fineness, we have also obtained the environmental characteristics of a permanent formed film.

WTP BK Series

Black Resist for Frames

In addition to its function as a light-shielding film, this negative resist has multiple functions, including chemical resistance and high adhesion. This product is used for touch panel frames.

Touch Panel Image of Cover Glass

Touch Panel Image of Cover Glass

Surface Resistance

Conditions

Substrate

CS glass (with alkali treatment)

Pre-bake

100℃, 120sec / Direct Hot Plate

Film Thickness

1.5μm (after post-bake)

Exposure

Mirror Projection Aligner,
200mJ/cm2, 15mW (JK-cut),
Mask 200μm Gap

Post-bake

60min at each temperature

Surface Resistance Data

Shape

Conditions

Substrate

CS glass (with alkali treatment)

Pre-bake

100℃, 120sec / Direct Hot Plate

Film Thickness

1.5μm (after post-bake)

Exposure

Mirror Projection Aligner,
200mJ/cm2, 15mW (JK-cut),
Mask 200μm Gap 60min at each temperature

Development

KOH 0.04%, 25℃ for each time duration

Post-bake

240℃, 30min

10um Mask

  Development Time
50sec 60sec 70sec
WTP BK Series WTP BK Series:Development Time 50sec WTP BK Series:Development Time 60sec WTP BK Series:Development Time 70sec

CFPR BK Series

Black Resist for Color Filter

This is a negative-type resist designed and developed to form a light-blocking barrier film for color filters using the photolithography process, which used to be formed by etching a chrome film. This resist has a black color, a light-blocking property with an optical density (OD) value of about 4, and high electrical resistance, and is used in the manufacture of color filters for displays.

Normal Type

Material Characteristics CFPR BK-6161SL
OD / 1 μm 4.5
BM Shape Angle > 50°
Width 5.0 μm
Surface Resistance 10E15Ω
Concentration 14.5%
  CFPR BK-6161SL
40mJ 60mJ
50sec 50秒 / CFPR BK-6161SL 40mJ
6.1 μm
50秒 / CFPR BK-6161SL 60mJ
7.4 μm
60sec 60秒 / CFPR™ BK-6161SL 40mJ
5.4 μm
60秒 / CFPR™ BK-6161SL 60mJ
6.5 μm
70sec 70秒 / CFPR™ BK-6161SL 40mJ
4.9 μm
70秒 / CFPR™ BK-6161SL 60mJ
5.8 μm

Conditions

Substrate

EXG glass

Pre-bake

100℃, 120sec / Direct Hot Plate

Film Thickness

1.0μm (after post-bake)

Exposure

Mirror Projection Aligner,
20mW, 200μm Gap,
40, 60mJ/cm2

Post bake

230℃, 30min

High Resistance Type

Material Characteristics CFPR BK-7742SL
OD / 1 μm 4.0
BM Shape Angle > 70°
Width 5.0 μm
Surface Resistance 10E15Ω
Concentration 14.5%

Conditions

Substrate

EXG glass

Pre-bake

110℃, 90sec /
Proximity pin 0.5mm

Film thickness

1.3μm (after post-bake)

Exposure

Mirror Projection Aligner,
60, 80, 100mJ/cm2

Development

KOH 0.04% at 23℃

Post bake

230℃, 20min oven

  60mJ 80mJ 100mJ
60sec 60秒:60mJ / 5.5μm
5.5 μm
60秒:80mJ / 6.0μm
6.0 μm
60秒:100mJ / 6.2μm
6.2 μm
70sec 70秒:60mJ / 4.1μm
4.1 μm
70秒:80mJ / 4.6μm
4.6 μm
70秒:100mJ / 4.9μm
4.9 μm
80sec 80秒:60mJ / 3.3μm
3.3 μm
80秒:80mJ / 3.9μm
3.9 μm
80秒:100mJ / 4.1μm
4.1 μm

CFPR in the text is a pending or registered trademark of TOK.

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