Resist with Environmental Characteristics in Addition to Uniformity and Fineness of the Formed Film
As part of the development of photolithography for display applications, we have been designing and developing photosensitive black pigment films. In addition to achieving uniformity and fineness, we have also obtained the environmental characteristics of a permanent formed film.
Black Resist for Frames
In addition to its function as a light-shielding film, this negative resist has multiple functions, including chemical resistance and high adhesion. This product is used for touch panel frames.
Substrate
CS glass (with alkali treatment)
Pre-bake
100℃, 120sec / Direct Hot Plate
Film Thickness
1.5μm (after post-bake)
Exposure
Mirror Projection Aligner,
200mJ/cm2, 15mW (JK-cut),
Mask 200μm Gap
Post-bake
60min at each temperature
Substrate
CS glass (with alkali treatment)
Pre-bake
100℃, 120sec / Direct Hot Plate
Film Thickness
1.5μm (after post-bake)
Exposure
Mirror Projection Aligner,
200mJ/cm2, 15mW (JK-cut),
Mask 200μm Gap 60min at each temperature
Development
KOH 0.04%, 25℃ for each time duration
Post-bake
240℃, 30min
Development Time | |||
---|---|---|---|
50sec | 60sec | 70sec | |
WTP BK Series |
Black Resist for Color Filter
This is a negative-type resist designed and developed to form a light-blocking barrier film for color filters using the photolithography process, which used to be formed by etching a chrome film. This resist has a black color, a light-blocking property with an optical density (OD) value of about 4, and high electrical resistance, and is used in the manufacture of color filters for displays.
Material Characteristics | CFPR BK-6161SL |
---|---|
OD / 1 μm | 4.5 |
BM Shape Angle | > 50° |
Width | 5.0 μm |
Surface Resistance | 10E15Ω |
Concentration | 14.5% |
CFPR BK-6161SL | ||
---|---|---|
40mJ | 60mJ | |
50sec | 6.1 μm |
7.4 μm |
60sec | 5.4 μm |
6.5 μm |
70sec | 4.9 μm |
5.8 μm |
Substrate
EXG glass
Pre-bake
100℃, 120sec / Direct Hot Plate
Film Thickness
1.0μm (after post-bake)
Exposure
Mirror Projection Aligner,
20mW, 200μm Gap,
40, 60mJ/cm2
Post bake
230℃, 30min
Material Characteristics | CFPR BK-7742SL |
---|---|
OD / 1 μm | 4.0 |
BM Shape Angle | > 70° |
Width | 5.0 μm |
Surface Resistance | 10E15Ω |
Concentration | 14.5% |
Substrate
EXG glass
Pre-bake
110℃, 90sec /
Proximity pin 0.5mm
Film thickness
1.3μm (after post-bake)
Exposure
Mirror Projection Aligner,
60, 80, 100mJ/cm2
Development
KOH 0.04% at 23℃
Post bake
230℃, 20min oven
60mJ | 80mJ | 100mJ | |
---|---|---|---|
60sec | 5.5 μm |
6.0 μm |
6.2 μm |
70sec | 4.1 μm |
4.6 μm |
4.9 μm |
80sec | 3.3 μm |
3.9 μm |
4.1 μm |
CFPR in the text is a pending or registered trademark of TOK.
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