High Surface Uniformity, Microfabrication, High-Sensitivity Photoresist for Large Substrates
This is a positive photoresist for wiring patterning designed and developed for display applications using large glass substrates. The product lineup includes both spin coat and slit coat resists. In addition to the longitudinal control and etchant resistance required, these resists offer excellent on-surface uniformity when applied to large substrates. In addition, they can be used on a wide range of substrates, including Al and ITO.
DOF @ 1.3 μm L/S EOP | |
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TFR-DI750 | 18 μm (-9~+9 μm) |
1.5 μm | 1.4 μm | 1.3 μm | 1.2 μm |
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TFR-DI750@ 42mJ/cm2 | EOP | ||
1.5 μm | 1.4 μm | 1.3 μm | 1.2 μm |
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TFR-DI750@ 42mJ/cm2 | |||
EOP |
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DI NEXT@ 42mJ/cm2 | |||
EOP |
TFR in the text is a pending or registered trademark of TOK.
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