TFR-Di Series

TFR-Di Series

High Surface Uniformity, Microfabrication, High-Sensitivity Photoresist for Large Substrates

This is a positive photoresist for wiring patterning designed and developed for display applications using large glass substrates. The product lineup includes both spin coat and slit coat resists. In addition to the longitudinal control and etchant resistance required, these resists offer excellent on-surface uniformity when applied to large substrates. In addition, they can be used on a wide range of substrates, including Al and ITO.

Features

  • High refinement
  • High sensitivity
  • Wide focus margin
DOF @ 1.3 μm L/S EOP
TFR-DI750 18 μm (-9~+9 μm)
DOF @ 1.3 μm L/S EOP

MASK Dimensions

1.5 μm 1.4 μm 1.3 μm 1.2 μm
TFR-DI750@ 42mJ/cm2   EOP  
1.5μm:TFR™-DI750@ 42mJ/cm2 1.4μm 1.3μm:EOP 1.2μm

MASK C.D.

1.5 μm 1.4 μm 1.3 μm 1.2 μm
TFR-DI750@ 42mJ/cm2
1.5μm:TFR™-DI750@ 42mJ/cm2 1.4μm:TFR™-DI750@ 42mJ/cm2 1.3μm:TFR™-DI750@ 42mJ/cm2 EOP
EOP
1.2μm:TFR™-DI750@ 42mJ/cm2
DI NEXT@ 42mJ/cm2
1.5μm:TFR™-DI750@ 42mJ/cm2 1.4μm:TFR™-DI750@ 42mJ/cm2 1.3μm:TFR™-DI750@ 42mJ/cm2 EOP
EOP
1.2μm:TFR™-DI750@ 42mJ/cm2

TFR in the text is a pending or registered trademark of TOK.

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