Photoresist Lineup Supporting the Most Advanced ArF Lithography Technologies
As a leading manufacturer of photoresists, we offer a wide range of photoresists that support advanced micropatterning by semiconductor ArF photolithography processes, including ArF dry exposure, immersion exposure, and multi-patterning technologies such as DTD and PTD, securing top market share in this field.
These resists are designed and developed for line formation.
BARC on Si
NA: 0.85, σ: 0.60
TMAH 2.38%, LD nozzle, 30sec
+/- 10% CD
These resists are designed and developed for hole formation.
TARF in the text is a pending or registered trademark of TOK.
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