Semiconductor and MEMS sensors are not only based on silicon substrates, but also on glass substrates and organic materials, where microfabrication techniques are used to create unique shapes and structures in addition to electronic circuits. Tokyo Ohka Kogyo develops material that are most suitable for such special processes.
From the reverse tapered resist pattern, the desired metal and wiring layers can be formed on the substrate through metal deposition or metal sputtering without the need for etching.
These products are used to prevent debris from being deposited during blade∕laser dicing. The same materials can also be used as a mask material during plasma dicing.
Wet etching of glass can yield special shapes.
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