This section discusses "double patterning," used in the manufacture of nm-class processes when ArF immersion lithography system and other methods cannot resolve the image.
This section discusses "low defect positive photoresists for immersion ArF," materials for processing semiconductors using ArF immersion lithography equipment.
Chips produced using this product are used in smartphones, now beloved worldwide.
We are also involved in the design and development of cleaning solutions with new functions to remove unclassified debris from semiconductors.
Photoresists for i-line were introduced in the late 1980s. Even today, while KrF photoresists have replaced it in feature miniaturization, i-line photoresists continue to play an active role.
This section discusses "SAW filters," which contribute to the downsizing, high performance, and multi-functionality of cell phones and other devices by taking advantage of its low profile and lightweight characteristics.
This section discusses "TLDP," used in the dicing process to cut semiconductor chips into chips for packaging.
This section introduces technology behind our products that are used in the latest semiconductor packaging industry.
Our photoresists for packaging are used in the semiconductor packaging technology for smart phones. Included here is an explanation of this packaging technology and the features of our products.
We will introduce our technology for fan out packages that can be used for multi-chip applications without being limited by chip size.
Image sensors are widely used in medical fields and for car cameras. Our "microlens resists" are used in these sensors.
This section describes "photo spacers (PS)" on columns, formed through photolithography of photosensitive resin on spacers.
Tokyo Ohka Kogyo has successfully developed high definition photoresists for displays ahead of the competition, resists which are now being implemented in various products.
We have developed a wafer handling system for attaching and detaching support glass to and from wafers, respectively, and for cleaning temporary adhesives.
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