Tokyo Ohka Kogyo is focusing on creating demand in new fields based on the development capabilities, responsiveness, and high value-added products we have cultivated in the semiconductor photoresist business.
We regularly update our technical information. Please feel free to contact us if you would like to know more about our products and services.
We hope that you will find our latest technical information useful for development in a variety of fields.

Technology Information List

Semiconductors

What is Double Patterning?

What is Double Patterning?

This section discusses "double patterning," used in the manufacture of nm-class processes when ArF immersion lithography system and other methods cannot resolve the image.

Semiconductors

 
Development of Low Defect Positive Photoresist for Immersion ArF

Development of Low Defect Positive Photoresist for Immersion ArF

This section discusses "low defect positive photoresists for immersion ArF," materials for processing semiconductors using ArF immersion lithography equipment.

Semiconductors

Development of Thick Film Positive Photoresist for KrF 3D-NAND

Development of Thick Film Positive Photoresist for KrF 3D-NAND

Chips produced using this product are used in smartphones, now beloved worldwide.

Semiconductors

Development of Cleaning Solutions for Advanced Semiconductor Processes

Development of Cleaning Solutions for Advanced Semiconductor Processes

We are also involved in the design and development of cleaning solutions with new functions to remove unclassified debris from semiconductors.

Semiconductors

I-Line Photoresists That Contribute to Power Semiconductor Production

I-Line Photoresists That Contribute to Power Semiconductor Production

Photoresists for i-line were introduced in the late 1980s. Even today, while KrF photoresists have replaced it in feature miniaturization, i-line photoresists continue to play an active role.

Semiconductors

Semiconductor Packaging

TMMR & TMMF Series (Development of Photosensitive Insulating Materials)

TMMR & TMMF Series (Development of Photosensitive Insulating Materials)

This section discusses "SAW filters," which contribute to the downsizing, high performance, and multi-functionality of cell phones and other devices by taking advantage of its low profile and lightweight characteristics.

Semiconductor Packaging

TLDP Development

TLDP Development

This section discusses "TLDP," used in the dicing process to cut semiconductor chips into chips for packaging.

Semiconductor Packaging

Development of PMER P-CX and P-CZ Series Thick Film Resists for High Speed Plating

Development of PMER P-CX and P-CZ Series Thick Film Resists for High Speed Plating

This section introduces technology behind our products that are used in the latest semiconductor packaging industry.

Semiconductor Packaging

evelopment of High Speed Cu Pillar Plating Materials for WL-CSP

Development of High Speed Cu Pillar Plating Materials for WL-CSP

Our photoresists for packaging are used in the semiconductor packaging technology for smart phones. Included here is an explanation of this packaging technology and the features of our products.

Semiconductor Packaging

Development of Cu RDL (Redistribution Layer) for FO (Fan Out) Packages

Development of Cu RDL (Redistribution Layer) for FO (Fan Out) Packages

We will introduce our technology for fan out packages that can be used for multi-chip applications without being limited by chip size.

Semiconductor Packaging

Sensors

Development of High Heat Resistance, High Transparency Microlens Resists Using Novel Polymer

Development of High Heat Resistance, High Transparency Microlens Resists Using Novel Polymer

Image sensors are widely used in medical fields and for car cameras. Our "microlens resists" are used in these sensors.

Displays

Development of Halftone Photospacers for High Definition LCD Panels

Development of Halftone Photospacers for High Definition LCD Panels

This section describes "photo spacers (PS)" on columns, formed through photolithography of photosensitive resin on spacers.

Displays

Development of Positive Photoresist for High Resolution for FPD TFR-DI700/750/793

Development of Positive Photoresist for High
Resolution for FPD TFR-DI700/750/793

Tokyo Ohka Kogyo has successfully developed high definition photoresists for displays ahead of the competition, resists which are now being implemented in various products.

Displays

Processing Equipment

Development and Commercialization of Zero Newton™2 Equipment

Development and Commercialization of Zero Newton™2 Equipment

We have developed a wafer handling system for attaching and detaching support glass to and from wafers, respectively, and for cleaning temporary adhesives.

Processing Equipment

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