What does a semiconductor look like? Many people think of semiconductor chips with many tiny pins protruding out like legs on a centipede, as shown in the image below. The technology known as wire bonding connects these pins to the LSI pins on the chip with a wire (metallic needle), and was for a time the predominant packaging method. However, since it would be extremely time-consuming to connect all the pins one by one to form the "centipede legs" given modern dimensions, a method called wireless bonding is used to connect the pins without wires.
In this wireless bonding method, the electrodes of the semiconductor chip are connected to the package substrate by a series of protruding pins called "bumps" instead of wires. This eliminates the need to connect wires one by one, thus improving the production efficiency of semiconductor chips. In addition, the space that used to be filled with wires can be eliminated, leading to smaller and thinner chips, and shorter wires allow for faster transmission of electrical signals.
PMER in the text is a pending or registered trademark of TOK.
As mentioned above, wireless bonding is attracting attention as a leading-edge technology in the back end process due to its various advantages, and our products are used to form the protruding pins (bumps) that directly connect the semiconductor chip to the packaging substrate. These two products take advantage of the excellent stripping performance of positive resists to overcome problems that were difficult to solve with conventional products. In addition, composition has been improved to address the problem of resistance from high-speed plating solutions (for mass production). As a result, our thick film resists for the semiconductor packaging field have been adopted by major device manufacturers for the first time, and this has led to the promotion of sales of related resists.
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