Tokyo Ohka Kogyo Product Site
Adhesives
Fine patterning is possible by photolithography process. These photosensitive adhesives are suitable for Si to Si, Si to glass, and glass to glass bonding of semiconductor devices, MEMS sensors, semiconductor substrates, and support plates by selectively forming a fine patterned adhesive layer. It has low autofluorescence and low cytotoxicity, which makes it suitable for BioMEMS.
Photosensitive adhesives with high transmittance (99.9%@400nm, n=1.52@550nm) are also available.
Photosensitive Film Type TMMF NA1000 (Liquid Type TMMR NA1000PM)
Structure Formation and Substrate Bonding Can Be Done With a Single Material
- Negative type dry film resist (solvent development type)
- Suitable for low temperature bonding
- Low auto-fluorescence, extremely low cytotoxicity (ISO-10993-5 compliance)
Film Type Process Flow
Applications: Semiconductor chip to chip bonding, semiconductor chip to substrate bonding. Other applications include printer heads, LEDs, TSV bonding, semiconductor and sensor module manufacturing.
- Low Temperature Curing (200℃)
- PGMEA Development
- Good Adhesion
- Suitable film thickness range (5~60μm)
- High heat resistance (up to 280℃)
- Chemical resistance
Bonding Strength
Auto-Fluorescence
We offer two types of products: the film type TMMF NA100 for lamination and the liquid type TMMR NA100 for spin application.
TAMFC, TMMF, and TMMR in the text are pending or registered trademarks of TOK.
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