Surface Treatment Agent That Modifies Hydrophilic to Hydrophobic Properties and Adhesion Improver That Prevents Peeling Between Organic Film Layers
This is a surface treatment agent for ensuring adhesion to the substrate during the photolithography process and the formation of organic film laminated structures. We offer two types of products: a surface modifier that modifies the substrate surface to be hydrophobic, and a coating material that improves the adhesion between the upper and lower layers when forming multilayer organic structures.
CAUT-200 Is Designed to Improve Adhesion Between Substrate and Photoresist by Modifying the Hydrophilic Wafer Surface
CAUT-200 is a coating material that improves the adhesion between the base and top layers when forming multilayer structures.
By applying and baking CAUT-200 as a pretreatment for the top layer material on the base layer film (or substrate), CAUT-200 will form an organic layer of several nm on the surface of the base layer and improve the adhesion between the base layer film (substrate) and the top layer material.
Epoxy polymers are applied on the coated surface and bonded to the substrate surface by thermal reflow.
OAP (HMDS) treatment of substrates with hydrophilic (-OH) groups allows for a simple hydrophobic treatment with silylation.
It can be used in photolithography to improve the adhesion between the substrate and the photoresist.
HMDS treatment of hydrophilic surfaces on silicon substrates and SiO films that incorporate OH groups improves resist adhesion by trimethylsilylating the substrate interface. It is possible to prevent resist pattern collapse during development and reduce the amount of side etching during wet etching.
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