Tokyo Ohka Kogyo Product Site
Baking Equipment
We offer a heat treatment system that enables high-precision temperature control of the substrate surface under ultra-low oxygen concentrations and rapid temperature rise and fall for large square substrates.
High Speed Heat Treatment System for Square Substrates
High Speed Heat Treatment With Excellent Temperature Uniformity Across Entire Surface of Substrate Under Ultra-Low Oxygen Concentration and Rapid Temperature Rise and Fall For Large Square Substrates
This single-wafer baking system enables rapid temperature rise and fall under ultra-low oxygen concentration and high uniformity temperature control within the substrate surface for large square substrates (6 generation, 4.5 generation).
The single-wafer baking system enables high-precision baking processing with high-precision substrate temperature control and no variation within or between substrates.
Application Example: polyimide varnish baking
Specs
| Processing Method | Single-wafer type (Maximum 3 units can be loaded) |
|---|---|
| Heat Source | IR Heater |
| Applicable Substrate Size | TN90000N Series：1500×1850(mm) 、TN45000N Series：730×920(mm) |
| Maximum Baking Temperature | 500°C |
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