The Process Equipment Division develops, manufactures, and sells equipment that ensures process superiority by chemically reacting materials or performing special treatments, based on the principle of "meeting society's expectations with chemistry."
Our semiconductor packaging equipment includes the Zero Newton™ series for three-dimensional packaging, fan-out packaging equipment (FOWLP and FOPLP), and resist ashing equipment that removes resist by plasma processing.
We also offer coating equipment for wafers and flexible displays, baking equipment for large square substrates, and UV curing equipment that improves plasma resistance and heat resistance by reacting photoresist with UV.
We hope you will consider using Tokyo Ohka Kogyo products, which are designed to meet expectations for process verification, new equipment sales, maintenance, and modification, both in Japan and overseas.

Zero Newton in the text is a pending or registered trademark of TOK.

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