TOK supports the miniaturization of semiconductors and other devices through photoresists for plating and photosensitive permanent film used in high-density integration.

Plating Photoresist For Advanced High Dencity Packages

TOK's Semiconductor Packaging Field

We are focused on developing photoresists for plating to address redistribution layers (RDLs) aimed at ultra-small targets and continuous electrolytic plating. We are also focused on developing photoresists for plating that target the formation of μ-bumps, tall copper pillars, and stud gold bumps.
The advantages of positive photoresists include not only their proven track record by customers and their resolution and rectangularity, but also their detachability and resistance to electrolytic plating solution processes (flexibility and resistance to plating chemicals), compared with dry film photoresists and negative photoresists.
Going forward, TOK will continue devoting efforts to helping improve the yields of our customers.

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This is the TOKYO OHKA KOGYO (TOK) special website for the high-density integration field. We are focused on developing photoresists for plating that target the formation of microbumps (μ-bumps), tall copper pillars, and stud gold bumps. We supply photoresists with outstanding detachability and resistance to electrolytic plating solution processes, in addition to their resolution and rectangularity.