We revised the product catalog for semiconductor back end processes (semiconductor packages).
For stand-up reading, click here.
We issued a new catalog covering the semiconductor packages of Tokyo Ohka Kogyo Co., Ltd. As we can provide it as a digital catalog, make an application for it from here.
For making a request for the catalog, click here.Topics
January 7, 2011
The panel data was changed.
The panel data was changed.
January 1, 2011
We inserted "Notice about our participation in the 12th Semiconductor Package Technological Exhibition (IPC)" into the News Release.
We inserted "Notice about our participation in the 12th Semiconductor Package Technological Exhibition (IPC)" into the News Release.
June 1, 2010
We developed a high-heat resistance temporary setting material for TSV processes dedicated to SD-LSI.
For further details, click here.
We developed a high-heat resistance temporary setting material for TSV processes dedicated to SD-LSI.
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Introduction of Tokyo Ohka Kogyo Co., Ltd.
Tokyo Ohka Kogyo Co., Ltd. supplies chemicals and manufacturing equipment such as photoresists (sensitive resign) required to manufacture semiconductors and flat panel displays (FPD). At this site, we present the optimum electronic materials and manufacturing equipment for MEMS/semiconductor packages/TSV/WHS manufacturing processes.
Under the name of product brand "Zero Newton" in the wafer flaking technology, our products to meet various requirements for two-sided devices and special wafers including wafer pasting units and support plate separating units are lined up. We are proposing development/manufacturing solutions in the MEMS/semiconductor packages/TSV/WHS fields.
Under the name of product brand "Zero Newton" in the wafer flaking technology, our products to meet various requirements for two-sided devices and special wafers including wafer pasting units and support plate separating units are lined up. We are proposing development/manufacturing solutions in the MEMS/semiconductor packages/TSV/WHS fields.
Introduction of noteworthy technologies (MEMS・TSV・WHS)
TSV technology
Photoresists line up for TSV process. The tenting photoresist for via plating and the photoresist for RLD/bump.
For further details, click here.
Semiconductor package technology
Photoresists line up for package.They are applicable to a thickness of 2 to 90 μm.
For further details, click here.
Resist stripper
Resist stripper is applicable to various photoresists (positive/negative type) and dry films.
For further details, click here.
Manufacturing equipment
High-performance equipment for TSV/CSP/MEMS.
For further details, click here.